| Product Description |
BusFlow® 500 Connector with Side Rigid Busbar+ Thermal Sensor |
| Physical Characteristic |
| Housing Material |
PA10T |
| Contact Material |
High Copper Alloy |
| Plating Material on Contact Area |
Ag PLATING: 200u" Min. OVER ALL;
50u" NICKEL UNDERPLATING |
| Durability |
50 |
| Case Color |
Black |
| Environment Characteristic |
| RoHS/ Halogen Free(HF) Compliance |
Halogen Free |
| Packaging |
Tray |
